First is FPGA. The increment of chip density and improvement of software makes it used more widely in image processing.
第一种是FPGA，由于不断增加的芯片密度和改进的软件工具，使得它在图像处理中的应用越来越广泛。
The influence of parasitic interconnect capacitance is much in evidence with the progress of the semiconductor techniques and the increase of chip density and calculated speed.
随着半导体工艺的进步，芯片集成度和运算速度的提高，互连寄生效应的影响也日益明显。
POWER7 provides increased processor core density per chip or socket, improved multithreading support, and improved core memory bandwidth (discussed below).
POWER 7在每一个芯片或插槽上增加了处理器内核密度，改进了多线程支持，并且改进了内核内存带宽(下面介绍)。
Samsung has announced the world's highest density DRAM chip, a 4GB DDR3 module, which is manufactured using a 50nm technology and is double the size of previously available DDR3 chips.
三星宣布了世界上密度最高的DRAM芯片，4GBDDR3模块，以50纳米技术制造，为现有DDR3芯片容量的2倍。
Samsung expects to have more than 10 percent of its total DRAM chip production in 2012 at the 4gb (or higher) density.
据三星预计，2012年三星将有10%的内存芯片产品是基于4gb及更高容量密度的芯片。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。
That is, the tendency is to use the increased density to make the same chip smaller and consume less power, to make phones smaller and make batteries last longer.
也就是说，这种趋势就是通过提高晶体管的密度使芯片更小，并消耗更少的电能，也就意味着可以将手机做得更小，电池续航时间更长。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
The card is PCI add card, comprised with the core chip, a high density high capability FPGA, and the image collect chip, image output chip, PCI bridge chip and the DDR RAM.
该卡是以高密度高性能的FPGA芯片为核心，图像采集芯片、图像输出芯片、PCI桥芯片、DDR动态存储器等为辅助的PCI扩展卡。
By giving an example which USES GAL to develop a binary ratio multiplier, the author explains in detail the method of using GAL chip to develop a high-density integrated circuit.
通过给出一个用通用阵列逻辑芯片GAL开发二进制比例乘法器的事例，详细介绍了用GAL芯片开发高集成度逻辑电路的方法。
The method which integrates PCI bus interface and control logic into a FPGA chip improves the integration density and transplantation of system.
该方法将PCI总线接口和控制逻辑集成于一片FPGA中，提高了系统的集成度和可移植性。
The MCS 51 single chip machine is used to design the gas monitoring system, which can survey the change of the gas density in the room correctly and offer the alarm signal.
采用MCS -51系列单片机来设计可燃气体监测系统，能准确探测室内气体浓度变化规律，并能显示气体浓度的大小，提供报警信息。
Then, the mathematical expression of heat flow density on the tool-chip interface of the rake face is deduced on the basis of milling temperature experiment.
结合铣削温度试验，推导出了前刀面刀—屑接触面输入的热流密度的函数表达式。
Provided are a chip component mounting structure and a chip component mounting method for increasing density.
本发明涉及可实现高密度化的芯片部件的安装构造以及安装方法。
This paper presents a method of flux compensation of saturated vapor. This method adopts parabola fitting the curve of temperature-density and deals with the data by MCS-51 single-chip computer.
提出一种采用二次抛物线来拟合温度—密度曲线进行饱和蒸汽的流量补偿的方法，并且用MCS-51单片机进行数据处理。
This paper presents a method of flux compensation of saturated vapor. This method adopts parabola fitting the curve of temperature-density and deals with the data by MCS-51 single-chip computer.
提出一种采用二次抛物线来拟合温度—密度曲线进行饱和蒸汽的流量补偿的方法，并且用MCS-51单片机进行数据处理。
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