Pretreatment, silver plating, nickel plating and tin plating of chip components.
应用于片式元器件的前处理、镀银、镀镍、镀锡等工艺。
Introduced the package technology and technical standards for management of chip components and devices.
介绍了片式元器件的先进包装技术以及管理上所采用的技术标准。
The shape may conform to the components inside the housing such as the PCB, speakers, microphones, chip components, IC's or the like.
该形状可与外壳内的部件一致，例如PCB、扬声器、麦克风、芯片部件、IC等。
This kind of material is used to make dielectric filters and miniature, light and chip components for communication equipments in decimeter-wave region.
利用该种材料制成了介质滤波器及分米波通信设备用的小型、轻量的片式元器件。
This kind of material is used to make dielectric filters and miniature, light and chip components for communication equipments in decimeter-wave region.
利用该种材料制成了介质滤波器及分米波通信设备用的小型、轻量的片式元器件。
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