As examples of VFG, this paper introduces in detail the system - and chip-level VFG of electronic devices.
作为虚拟特征生成实例，本文以电子设备概念设计为例，详细介绍了系统级和芯片级的虚拟特征生成方法。
A kind of chip-level test controller which can flexibly carry out the result of test scheduling is presented, which also takes chip test scheduling into account.
本文首次将测试调度问题与芯片级测试控制器设计问题结合起来，提出了一种能够灵活实现各种测试调度结果的芯片级测试控制器设计。
"We clearly demonstrated that we can do it at the unit chip level," says Kim.
金说“我们证实了我们可以在单元芯片级做到这个。”
Think about the loosely-coupled architecture being scaled down to the chip level.
可将其看作松耦合架构按比例缩小至芯片级。
Deep ocean gauges in the north Pacific had detected waves up to 2m above normal sea level, said Chip McCreary of the Pacific Tsunami Warning Centre.
北太平洋的深海测量仪器显示海浪达到了2米，这要高于正常水平，太平洋海啸预警中心的Chip McCreary说。
Tool shipments are running at a rate suggesting annual semiconductor capital spending of $40bn to $50bn, a level that has tended to cause meaningful rises in chip manufacturing capacity in the past.
以目前半导体设备的出货量计算，半导体行业的年度资本支出将达到400亿至500亿美元，在过去，这一支出水平往往表明，芯片制造产能将出现大幅度的增长。
Speaking to The Register, the chip maker confirmed that at least on some level they are working with Google in the development of Chrome OS.
这家芯片制造商肯定地表示，至少在某些层面上他们正在与Google合作开发ChromeOS.
This software logic can be written in a higher level programming language, or it can be executed as assembler logic on a computer chip.
这里的软件逻辑可以使用较为高级的编程语言编写，可作为汇编程序逻辑在计算机芯片上执行。
Women also hold more than half of the entry-level jobs at American blue-chip companies.
在美国的一流公司，初级职位的一半以上也有女性占据。
"The term 'embedded' used to refer to a low-level, limited-function semiconductor and nobody needed to pay attention to it," said Shane Rau, a chip expert at the market research firm IDC.
“过去，术语‘嵌入式’指低水平的、功能有限的半导体，人们也无需关注它，”市场调研公司国际数据公司(IDC)的芯片专家谢恩·劳说。
They can be classified into wafer level, chip level, and package level stacking.
它们可以分为圆片级封装、芯片级封装、和封装面。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
Yantai Hong sends the technical service center, is one bases on the IT product chip level service technology science and technology enterprise.
烟台洪发科技维修服务中心，是一家立足于IT产品芯片级维修技术的科技型企业。
The chip level linear minimum mean square error (LMMSE) equalizer in CDMA systems is introduced.
介绍了码分多址CD MA系统中码片级线性最小均方误差均衡器。
Conclusion: the implanted chip system can regulate the blood pressure successfully and keep the blood pressure in a lower constant level without adaptation.
结论：植入式芯片系统能有效地将血压控制在设定范围，且未产生适应现象。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
It gives comparison among some methods which are often adopted in the interfacing circuit, and introduces a chip MAX232 of level translation and its application method in detail.
对于硬件接口电路中常用的一些方法进行了简要的比较，并介绍了电平转换芯片MAX232及其应用方法。
Several key chip and computer vendors now offer optimized Level 1, 2, and 3 BLAS .
一些钥匙薄片和计算机厂商现在提议将水平1，2，和3BLAS 最佳化了。
This paper focuses on performance estimation of the embedded microprocessor based on the on-chip bus, including on-chip bus modeling, high-level simulation environment building and their combination.
本论文的主要工作即着重于系统芯片中片上总线结构的性能评价研究，包括总线结构的建模、系统仿真环境的建立以及性能评价的方法。
Year 2007: Accomplished chip level R&D, deep research about the protocol of USB, COM and etc. , master the tech. of how to control electronic and automatic equipments through computer.
2007年：完成电子设备芯片级开发，对USB、COM口等接口协议进行深入研究，实现通过计算机对电子、自动化设备进行控制。
It can satisfy the requirement of digital plugboard test and carry out the plugboards test to chip level. Thus it has wide application potential.
它满足雷达数字插件板测试需求，能实现芯片级测试，具有广阔的应用前景。
One of the important characters of information security chip is that the keep and operation of data are under encryption, which enhances the level of information security.
安全芯片的一个重要特征在于其数据是在加密的情况下进行存储甚至运算，这使得其安全性大为加强。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
In most of the cases, software cannot protect data from leakage or hacked by chip level hackers.
在很多场合，在芯片级的黑客面前，软件无法防止数据泄密。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
At the same time, the using of circuit chips such as high precision RMS detecting chip enhanced the overall level of the transmitting and receiving devices.
同时采用诸如高精度有效值检测电路等专用芯片提高了电磁发射、接收设备的整体水平。
At the same time, the using of circuit chips such as high precision RMS detecting chip enhanced the overall level of the transmitting and receiving devices.
同时采用诸如高精度有效值检测电路等专用芯片提高了电磁发射、接收设备的整体水平。
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