Finally, the channel-structured glass substrate was sealed to a cover glass plate by using room temperature bonding technique.
最后，采用室温键合技术，将带有微纳结构的基片与盖片封合成玻璃微-纳流控复合芯片。
The ligating structure includes a channel (48) that is configured to receive a corrective device (16) therein and to restrict the corrective device from movement relative to the tooth bonding pad.
绑扎结构包括通道(48)，其配置以将矫正设备(16)接收于其中，并且限制矫正设备相对于牙结合垫的移动。
In the process of thermal bonding, experiments are carried out under different conditions such as variable polymer thick, temperature, channel width and time.
在对微纳米通道进行热键合过程中，分别改变键合胶层厚度，键合温度，通道尺寸和键合时间四个条件进行了实验。
In the process of thermal bonding, experiments are carried out under different conditions such as variable polymer thick, temperature, channel width and time.
在对微纳米通道进行热键合过程中，分别改变键合胶层厚度，键合温度，通道尺寸和键合时间四个条件进行了实验。
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