Thin surface mount ceramic package.
薄形陶瓷表面贴封装。
This module used DIP ceramic package, therefore it is very easy to form 16, 32,... and 160 unit modules.
组件采用双列直插式陶瓷管壳封装，很容易制成16、32……160元组件。
The reasons of plating layer blister on multilayer ceramic package are analyzed. On the base of practice the resolve methods are indicated.
本文对多层陶瓷外壳电镀层起泡的成因进行了探讨和分析。在实际工作的基础上，提出了解决起泡应采取的措施。
According to the functional requirements, their technical characteristics consist of two ways on seal, ceramic package seal weld and tube polysulfone whirl forge seal, and the compact structure.
根据功能要求，本电气贯穿件的技术特点是采取了陶瓷组件封焊和钢管聚砜旋锻密封两种密封方法，以及紧凑的结构方式。
The characteristics of ceramic artworks were analyzed, and the universality and essentiality of buffering package were described in this paper.
分析陶瓷工艺品的特点，说明缓冲包装的普遍性和重要性。
The two chips are mounted on a ceramic substrate, and then hermetically sealed in a ceramic surface mount package.
这两款芯片安装在陶瓷基板，然后密封在一个密封的陶瓷表面贴装封装。
The package is a multilayer ceramic structure and has the electrical interconnection with logical function.
该封装为多层陶瓷结构，并具有电连接逻辑关系。
PACKAGE: in specific tankers, ceramic POTS and other acid-resisting packings.
包装：专用槽车、罐、瓷-其它耐酸包装物。
PACKAGE: in specific tankers, ceramic POTS and other acid-resisting packings.
包装：专用槽车、罐、瓷-其它耐酸包装物。
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