The chip component comprises a ceramic substrate and at least one radiating element.
芯片元件包括陶瓷衬底和至少一个辐射元件。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
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