The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
The sensor combines integrated bulk hall cell technology and instrumentation circuitry to minimize temperature related drifts associated with silicon hall cell characteristics.
该传感器将集成大量霍尔元件技术和进行信号调理的仪表电路整合在一起，从而使与硅霍尔元件特性相关的温度漂移降到最小。
This paper investigates one kind of micro heat pipe arrays (MHPA), which are fabricated by advanced silicon bulk micromachining and anodic bonding technology.
介绍了一种基于硅体加工技术以及阳极键合技术的微热管阵列。
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
A novel electrostatic actuated deformable mirror with continuous facet is designed and fabricated by using silicon bulk micromachining technology.
基于体硅微加工技术设计并制作了一种新型的采用静电驱动的连续面型可变形反射镜。
Introduced a new bulk silicon micromaching technology to replace SOI wafer with normal silicon wafer in the application of sidewall electrical connection.
介绍了一种全新的体硅微机械工艺，可以取代SOI硅片而直接在普通硅片上对不同的侧壁电学导通部分进行绝缘。
Introduced a new bulk silicon micromaching technology to replace SOI wafer with normal silicon wafer in the application of sidewall electrical connection.
介绍了一种全新的体硅微机械工艺，可以取代SOI硅片而直接在普通硅片上对不同的侧壁电学导通部分进行绝缘。
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