Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
The Cobra Detailing Towel falls in the middle which makes it equally suited for buffing, polishing, and cleaning.
眼镜蛇美容布介于中间，适合擦光、抛光和清洁。
The zero mold presents an opportunity to remove these witness lines by wet sanding, buffing and polishing.
零模为除去这些可见分界线提供了机会，可使用湿磨、抛光的方法。
Buffing head works from coarse grinding to fine polishing progressively. This line is able to polish mass volume products.
磨头分别按粗磨到精抛依次抛磨，能满足大批量产品抛磨。
Buffing head works from coarse grinding to fine polishing progressively. This line is able to polish mass volume products.
磨头分别按粗磨到精抛依次抛磨，能满足大批量产品抛磨。
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