A laser bonding device can rapidly and conveniently remove a cover layer on a lead with cover layer and perform the laser bonding on the lead and a terminal.
一种激光焊接装置，能够迅速且方便地进行带覆层导线的覆层除去作业、对该带覆层导线和端子的激光焊接作业。
A laser bonding device can rapidly and conveniently remove a cover layer on a lead with cover layer and perform the laser bonding on the lead and a terminal.
一种激光焊接装置，能够迅速且方便地进行带覆层导线的覆层除去作业、对该带覆层导线和端子的激光焊接作业。
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