Introduces several ways of bonding EPDM membrane laps and carries out cost analyses.
介绍了多种EPDM卷材与卷材接合部位粘贴方法，并进行了成本测算。
The technology cuts down on process flow of bonding and molding, as well as been useful for cost saving.
这种技术减少了对工艺流程的粘接，成型，以及节约成本是有益的。
As the used materials are innoxious, the invention is harmless to human bodies, low in cost and simple to manufacture, and has little smell, high bonding strength and favorable brushing property.
本发明因使用的原料无毒无害，因而不会对人体造成危害，成本低，加工简单，气味小，粘接强度高，涂刷性好。
The invention can effectively use metal silver, reduces the cost, improves the bonding force between plastics and the lead frame, and achieves the purpose of anti-layering.
本发明可以有效利用金属银，降低成本，提高塑料与引线框架的结合力，达到防分层目的。
The method has high machining efficiency, low machining cost, and be good for manufacturing the imitation wood grain edge bonding strip with good aesthetic feeling effect on a large scale.
且本方法加工效率高，加工成本低，有利于大规模生产美感效果好的仿木纹封边条。
By adding the grinded blast furnace slag, the invention can reduce the construction cost and improve the rigidity and the bonding performance.
本发明加入磨细的高炉矿渣粉，既可以降低施工成本，又提高硬度和粘接性能。
Advantage of the high adhesive bonding surface wave neat no spill phenomenon, but the cost is higher.
高波粘合优点是粘合表面整齐无溢漏现象，但成本较高。
The production cost of this system is 53 % lower than that of the relevant equipment abroad and the coatings show the same quality of bonding strength and porosity.
在保证涂层的结合强度、孔隙率等性能指标的前提下，喷涂成本比国外产品降低一半以上。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
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