A lower IGBT and an upper IGBT are excellently and firmly bonded by solder, the lower IGBT and a wire are firmly connected, and a highly reliable semiconductor device is formed.
能够通过焊锡良好地固定下部IGBT和上部IGBT，同时牢固地连接下部IGBT和引线，形成可靠性高的半导体器件。
A lower IGBT and an upper IGBT are excellently and firmly bonded by solder, the lower IGBT and a wire are firmly connected, and a highly reliable semiconductor device is formed.
能够通过焊锡良好地固定下部IGBT和上部IGBT，同时牢固地连接下部IGBT和引线，形成可靠性高的半导体器件。
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