The bond wire, the via hole and the uncontinuity of the microstrip's effect have been taken into account .
分析了变容二极管的等效电路模型，考虑了微带的不连续性、键合引线、通道孔对电路的影响。
The real contact area of the bond interface and the cross-sectional deformation of the bond wire were the causations respectively for the fluctuation and wholly increase of the resistance.
接头界面有效连接面积和接头上引线横截面变形量的变化分别是造成接头电阻波动性和整体增大趋势的原因。
A top-notch pair of tough Brits in Michael Fassbender (Inglourious Basterds) and Dominic West (The Wire), plus former Bond girl Olga Kurylenko.
两位一流的英国硬汉演员迈克尔·法斯宾德（主演《无耻混蛋》）和多米尼克·威斯特（主演《火线》），还有前邦德女郎欧嘉·科瑞兰寇。
To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.
为了用较小的规模模拟相对较长的金线和较大的焊盘，提出了一种温度场分析的等效方法。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
Another important part of work is having a research on the bond anchorage experiment of 9 strengthened beams with high-strength steel wire mesh.
论文的另一部分重要工作是9根钢绞线网-聚合砂浆加固混凝土简支梁的粘结锚固试验。
In this paper, bond and anchorage stress conditions between concrete and high-strength smooth wire for pre-tensioned concrete members are discussed.
本文讨论和分析了在先张预应力混凝土构件中混凝土和光面高强钢丝之间的握裹和锚固应力的情况。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface characteristics.
引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。
The bond pad (28) is then formed in contact with the barrier (26), and a wire bond (30) is then made to the bond pad (28).
随后形成接合焊盘（28）以接触阻挡（26），且随后对接合焊盘（28）完成线接合（30）。
The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.
MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
There are so many process parameters affecting bond quality in wire bonding and these parameters are directly related to the reliability of semiconductor device.
引线键合过程中的工艺参数较多，他们直接影响键合质量的好坏，影响半导体器件的可靠性。
There are so many process parameters affecting bond quality in wire bonding and these parameters are directly related to the reliability of semiconductor device.
引线键合过程中的工艺参数较多，他们直接影响键合质量的好坏，影响半导体器件的可靠性。
应用推荐