Recently years, the assembly of supramolecular compounds having special structure and function from simple building blocks directed by hydrogen bond formation has attracted widespread attentions.
利用氢键将有机小分子建筑块组装成具有特定结构的超分子成为近年来十分活跃的研究领域。
The nanocomposite with core/shell structures is an ordered assembly system in which one nanomaterial is covered by another nanomaterial via chemical bond or other interactions.
核/壳结构复合纳米材料是具有特殊性能的功能材料，是由一种纳米材料通过化学键或其他相互作用将另一种纳米材料包覆起来形成的纳米尺度的有序组装结构。
Molecular recognition and molecular self-assembly through the non-covalent bond is the two important parts of supramolecular chemistry.
基于非共价相互作用的分子识别和自组装是超分子化学研究的两个重要的领域。
We take three factors into consideration including coupling agents, assembly time, and hot pressing time to analysis the influence they play to MOR, MOE, surface bond strength, bond strength.
确定偶联剂、陈化时间和热压温度为实验因素，以静曲强度、弹性模量、胶合强度、表面胶合强度为衡量指标。
Multiplayer shells assembly have characteristic, which are high dimension precision, strict form and position tolerance, difficult bond technology and etc.
多层壳体组件具有尺寸精度高、形位公差要求严、粘接难度大等特点。
The edge sealing structure improves the bond strength of the edge of the case frame and is beneficial to the construction and assembly of the case frame.
提高了该格框边缘的结合强度，并有利该格框的施工组装等效果。
The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.
MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
The assembly of MOSFET is consisted of five main processes, which are wafer sawing, die attach, wire bond, molding, trim and form.
MOSFET的封装主要由晶圆切割，晶粒黏贴，焊线，封塑，切割成型这五大流程组成。
应用推荐