The influences of each component content in plating bath, temperature and stirring speed on electroless nickel plating were discussed.
讨论了镀液中各组分含量、温度及搅拌速度对化学镀镍的影响。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
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