This thesis study the simulation of electromagnetic field of MB chip and two key fabrication processes—fabrication of planar electromagnetic devices based on UV-LIGA and polymeric microfabrication.
本论文研究了磁珠芯片中的电磁场模拟分析，以及两种关键工艺——基于UV-LIGA的平面电磁器件制作工艺和塑性材料微加工制作工艺。 在此基础上，设计、制作并封装了新型磁珠微芯片。
The characteristics and requests of micromachining for silicon based sensors are introduced. The conventional methods of si substrate microfabrication are briefly described.
叙述了硅基传感器微机械加工的特点和要求，简要说明了硅衬底微细加工的常用方法。
The characteristics and requests of micromachining for silicon based sensors are introduced. The conventional methods of si substrate microfabrication are briefly described.
叙述了硅基传感器微机械加工的特点和要求，简要说明了硅衬底微细加工的常用方法。
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