It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题，如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
In this study, the computational fluid dynamics approach is employed to analyze the heat transfer for ball grid array package that is popular in modern electronic industry.
本研究以计算流体力学的方法，对电子构装产品的明日之星- - -球栅阵列封装方式，来进行详细的热传分析。
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
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