The device comprises microelectrode array chip, signal path control part, stimulation signal generation part and coding part.
该装置包括微电极阵列芯片、信号通路控制部分、刺激信号产生及编码 部分。
It adopt the third generation light source array chip, it have balanced light, the brightness is more than 70 bright spot than the second array chip.
采用一个第三代点阵式芯片，光线均匀，其发光亮度为第二代阵列式70多个亮点。
Thanks to this chip and its array of sensors, a researcher was able to control it, using a laptop to cause it to fly around the room.
有了这个芯片和它的一系列传感器，研究员就可以通过一台笔记本电脑控制巨甲虫，让它在房间里转圈。
The chip is a crosspoint array with 32 outputs, each of which can be connected to any one of 32 inputs. The chip is programmed in serial mode.
所设计的芯片是32个输入32个输出的交叉点开关阵列，每一个输出都能连接任何一路输入，采用串行数字控制方式。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题，如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
According to the structures, DNA chip can be divided into two variants, DNA array and oligonucleotide microchip.
依其结构，DNA芯片可分为两种形式，DNA阵列和寡核苷酸微芯片。
The video digital processor chip XY-VDSP is an SIMD (Single Instruction Multide Data Stream)processor, in which array structure is used.
视频数字信号处理芯片XY VDSP是采用阵列结构的SIMD处理机。
An error ratio testing system featured with low cost, multi-speed grades, multi-interface and a SOPC based on a single field programmable gate array (FPGA) chip were presented.
利用单片现场可编程门阵列(FPGA)可构成一个SOPC，实现了低成本、多速率、多接口的误码测试系统。
An array of miniature heaters corresponding to the array of PCR chips is made on a flexible printed circuit board that provides distributed temperature compensation to each PCR chip.
在柔性印刷电路板上形成与芯片阵列对应的微型加热器阵列，针对各芯片进行分散的温度补偿。
EMC firstly applies FLASH chip solid state disk into the memory array, and unprecedentedly raises the performance and the energy efficiency.
EMC首次将FLASH芯片的固态硬盘运用于存储阵列，使其性能和能效获得前所未有的提升。
This paper describes the interface method to the dot array liquid crystal display and 8031 single chip microcomputer, the program chart is given.
讨论了点阵式液晶显示器与8031单片机的接口方法，给出了程序流程图。
An integrated photodetector system is designed and manufactured, in which the photodetector array and the read-out circuits are integrated on the same silicon chip.
设计研制了一种集成光电探测器系统，它将光电二极管阵列及信号读出电路集成在同一硅芯片上。
An initiative scheme is given to integrate the spectrometer, imaging system and high sensitivity photodiode array in a three dimension silicon chip.
讨论了实验分光系统、成像系统和高灵敏度探测器列阵混合集成在一块三维硅基片上的初步方案。
The cell fusion room of chip was completed by MEMS and made into an array of the microelectrode to realize huge cell fusion and to improve the efficiency of cell fusion.
采用微加工技术将芯片的细胞电融合小室制作成微电极阵列以实现细胞的大量融合，提高细胞的融合效率。
Host computer using field programmable gate array FPGA XC3S400 control the CC1100 RF transceiver chip to receive tire pressure information and accordingly respond to treatment.
上位机采用现场可编程门阵列fpgaXC3S400控制无线射频收发芯片CC 1100来实时接收胎压信息，并做相应应对处理。
Based on BAP128 chip, we propose a reconfigurable mesh, which improves the communication performance of SIMD array.
基于BAP12 8芯片，提出了一种可重构阵列，它改善了SIMD阵列的通信性能。
An array of sensitive membranes are distributed on the surface of the chip.
在芯片的表面分布有敏感膜阵列。
The company engages in the research and development as well as the production of the core chip technology of uncooled infrared focal plane array (FPA) and the infrared cameras.
公司主要致力于非制冷红外焦平面探测器核心FPA芯片技术及其红外热像仪的研发和生产。
Thick film type thermistor chip is composed of electrical insulated basis material and resistor array set.
一种厚膜式热敏电阻芯片及其制造方法，是由电性绝缘基材以及电阻排组所组成。
For uncooled focal plane array pixel maintain a steady temperature can improve the precision, temperature control system based on ADN8830 single-chip thermoelectric cooler controller is designed.
本文针对非制冷焦平面阵列像元温度保持恒定可以提高测试精度的问题，提出了基于ADN8830单芯片热电制冷器控制器的温控系统设计。
The array electrodes were produced by method of photolithography and stripping. and a PDMS-glass microfluidic chip integrating the array of electrodes was bonded efficiently.
采用光刻法和剥离法进行了阵列电极的制作，并成功键合了带有阵列电极的PD MS -玻璃混合微流控芯片。
Similar with traditional field sequential color LCOS microdisplay chip, it consists of three parts: row scan driver, data driver and pixel array. The main difference of them is the row access method.
与传统场序彩色LCOS微显芯片类似，该芯片的主要模块由行扫描驱动器、数据驱动器和象素驱动矩阵三大部分组成。
Similar with traditional field sequential color LCOS microdisplay chip, it consists of three parts: row scan driver, data driver and pixel array. The main difference of them is the row access method.
与传统场序彩色LCOS微显芯片类似，该芯片的主要模块由行扫描驱动器、数据驱动器和象素驱动矩阵三大部分组成。
应用推荐