It plays the role as oxidant and substrate respectively.
它分别扮演氧化剂和反应底物的角色。
Binding status and intensity of HA coating and substrate interface.
羟基磷灰石生物涂层与基体的界面结合状态及结合强度。
The deformation behaviors of anodic coatings and substrate were observed.
观察了氧化涂层及基体合金的变形行为。
Separation between two layers of coatings or between coatings and substrate.
涂层和基材之间、两种涂层之间的分离。
Substrate transfer apparatus, substrate process system, and substrate transfer method.
基片传递设备，基片处理系统，和基片传递方法。
The distribution of temperature was given at different times for coating and substrate.
给出了涂层和基体在不同时刻的温度场分布和变化规律。
Extracted tea protein by enzyme is mild reaction condition and substrate specialization.
酶法提取具有反应条件温和和底物特异性好等特点。
The bonding between coating and substrate as well as inside the coating appears to be mechanical.
涂层与基体间及涂层内部主要是机械结合。
The effect of two parameters of size of ZnO nanostructures and substrate on field emission is studied.
研究了形貌尺寸大小和衬底这两个参数对场发射的影响。
A new method for measuring bonding strength between electroplated layer and substrate of diamond tool is proposed.
提出一种新的电镀金刚石工具镀层与基体结合强度测试方法。
The bond strength between the coating and substrate can be enhanced through producing functionally graded coating.
通过制备梯度涂层可以提高涂层与基体之间的结合强度。
Besides oxidation, no other resultant of reaction has been found along inter - face between coating and substrate.
界面处除生成氧化物外，未发现其它反应生成物。
Plant-esterase tablet and substrate tablet were developed for rapid detection of organophosphorous pesticides in water.
研制出一种能快速测定水中有机磷农药的植物酯酶片和底物片。
The chip includes an active proteinase film, screened chemical arrays distributed on the film and substrate microarrays.
这种化合物阵列芯片由活性蛋白酶膜、化合物阵列及底物微阵构成。
Analysis and calculation on a single substrate and substrate covered by a changing char layer was conducted respectively.
分别对无碳化层和有碳化层两种状态进行了分析和计算。
Selection of adhesive for bonding strength fi eld pull-out tests of thermal insulation layer and substrate was introduced.
介绍了在保温板材与基层的粘结强度现场拉拔试验中粘结剂的选用。
The formation and disappearance of intermediates are largely affected by the reaction temperature and substrate concentrations.
反应温度和底物浓度对中间体的形成和消失有较大的影响。
Experimental results show that the deposition rate of silicon film strongly depends on silane pressure and substrate temperature.
实验结果表明，非晶硅的沉积速率与气室气压和基片温度密切相关。
And the relationship between time and substrate concentration in each compartment of ion exchange and current efficiency is discussed.
并对各室对应物的浓度以及电流效率与时间的关系进行了探讨。
Method of preparing a substrate, method of measuring, device manufacturing method, lithographic apparatus, computer program and substrate.
制备基底的方法，测量方法，器件制造方法，光刻装置，计算机程序和基底。
It is evident from our results that the charge transfer between adsorbed NO and substrate is similar to CO adsorption on transition metal.
计算了NO分子各个轨道上的占有数，发现其电荷转移情况与CO在过渡金属表面吸附的情况相似。
H plasma treatment changes the bond state between the deposit and substrate, resulting in a improved adhesion of the deposit to cemented carbide.
等离子处理改变了镀层和基体之间的结合状态，提高了镀层与硬质合金的结合强度。
The parameters of coated surfaces in this article are the hardness of coatings and substrate, the thickness of coatings, the roughness of substrate.
涂层参数是指涂层及基体的硬度值、涂层厚度和基体表面粗糙度。
The results show that the shearing strength of the interface between clad layer and substrate is higher than of substrate and clad layer of some alloys.
熔覆层与基材交界处的剪切强度比热影响区高，并比某些合金的熔覆层高。
In mechanical products using electrolysis deposited on attachment good, but the performance and substrate material of different metal coating technology.
利用电解作用在机械制品上沉积出附着良好的、但性能和基体材料不同的金属覆层的技术。
In the process of adatom diffusion, the deformation induced by the interaction of adatom and substrate plays an important role in the adatom's migration.
在表面原子扩散的过程中，由吸附原子与基体原子间相互作用引起的基体晶格畸变对表面原子的扩散运动将产生重要影响。
A low-temperature radiation heater and substrate heater are designed and made aiming at the low evaporating temperature of organic semiconductor materials.
针对有机半导体材料的蒸发温度低的特点，设计并制作了低温辐射式加热器和衬底加热器。
Techniques for soldering and encapsulating aluminum-alloy case and substrate based on low-temperature aluminum soldering materials are described in the paper.
文章介绍了一种采用低温铝钎焊料和钎焊技术的铝合金外壳基板钎焊和密封方法。
Techniques for soldering and encapsulating aluminum-alloy case and substrate based on low-temperature aluminum soldering materials are described in the paper.
文章介绍了一种采用低温铝钎焊料和钎焊技术的铝合金外壳基板钎焊和密封方法。
应用推荐