The Bainiuchang Ag deposit is a large Ag-Sn-pb-Zn deposit discovered and explored in recent years.
白牛厂银矿是近年发现探明的一大型银锡铅锌矿床。
The associated gold mineralization can be classified into two types: Au (Ag) -bearing polymetallic skarn sulphide Sn-Cu deposit and Au-be.
伴生金矿床可分为含金(银)多金属矽卡岩硫化锡铜矿床及含金脉(层)状锡铅矿床。
Properties and preparing process of tri layer films with Ag base coating, Ni electrodeposit, Sn Pb alloy for terminal electrode of multilayer chip inductor were described.
介绍了叠层片式电感三层端头电极即银基底电极、镍层、锡-铅合金镀层的性能及制备工艺。
The Sn, Pb, and Ag anomalies delineated with the technology have been identified by trenching.
利用该技术圈定的异常，经探槽揭露证实为矿化异常。
Choi S. Lee J. Guo F Creep properties of eutectic SnAg solder and Sn- Ag composite solders containing intermetallic particles.
史耀武。闫焉服。刘建萍金属颗粒增强的锡铅基复合钎料及其制备方法。
The physical properties, solderability, mechanical properties and the creep-rupture life of the nanon-sized Ag particles reinforced Sn-37Pb composite solder were investigated.
研究了纳米银颗粒增强锡铅基复合钎料的物理性能、工艺性能、力学性能和蠕变性能。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
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