A new technique for 3-d surface measurement is developed.
提出并研究了一种新的三维表面测试技术。
This technique has been successfully applied in BGA chip leads 3-d measurement.
此技术已成功地应用于BGA芯片管脚的三维测量。
The technique of 3-D profile measurement based on grating strips project, which created the strips by the computer, projected it through the projector, and captured the strips image by CCD camera.
光栅投影测量物体三维轮廓技术利用计算机生成光栅条纹，通过投影仪投射到被测物体表面，采用CCD摄像机捕获条纹图像。
The technique of 3-D profile measurement based on grating strips project, which created the strips by the computer, projected it through the projector, and captured the strips image by CCD camera.
光栅投影测量物体三维轮廓技术利用计算机生成光栅条纹，通过投影仪投射到被测物体表面，采用CCD摄像机捕获条纹图像。
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