重点介绍了高密度封装形式及应用前景。
Several types of high density packaging and their application prospects are emphatically described.
论述了高密度封装的设计考虑及材料的选择。
It also reviews the design considerations and selection of the packaging materials.
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
随着LSI和VLSI的飞速发展，LS I高密度封装技术变得越来越重要。
The high density packaging technology for LSI becomes more and more important as LSI and VLSI are developing rapidly.
本文叙述了高密度封装的类型，介绍了它们的一般结构，并提供了封装的外形标准。
This paper presents some types of high density package, describes their general constructions and also shows the outline standards of these packages.
本文对高密度封装中各结构成分的模型建立及分析作了讨论，根据这些方法编制了相应的程序。
Discussions are made about the modeling and analysis of various structural components in high density packaging. Relative programs have been tailored to suit these methods.
传统的前向拱丝越来越难以满足目前封装的高密度要求，反向拱丝能满足非常低的弧高的要求。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
这使电铸成为高密度应用，比如晶片封装优选技术。
This makes electroforming the preferred technique for high-density applications such as wafer bumping, where aperture counts are now more than 2 million.
高密度电子封装 HDEP?。
高密度电子封装 HDEP?。
应用推荐