建议用途：适用于树脂结合剂、陶瓷结合剂和电镀制品，加工硬质合金、玻璃、陶瓷、石材等非金属材料。
Suggested Applications: Applied to manufacturing resin bond, ceramic bond and coated diamond products; Processing hard alloy, glass, ceramics, stone and other non-metallic materials.
建议用途：适用于树脂、陶瓷结合剂砂轮、电镀产品，加工硬质合金、玻璃、陶瓷、石材等非金属材料。
Suggested Applications: Applied to manufacturing resin and ceramic bond grinding wheels, coated diamond products; Processing hard alloy, glass, ceramics, stone and other non-metallic materials.
适用范围：适用于树脂结合剂、陶瓷结合剂和电镀制品，加工硬质合金、玻璃、陶瓷、石材等非金属材料。
Recommended Applications: Resin bonded products, ceramic bonded and electroplated products; carbide, glass, ceramics, stone and other non-metallic materials.
适用范围：适用于树脂结合剂、陶瓷结合剂和电镀制品，加工硬质合金、玻璃、陶瓷、石材等非金属材料。
Recommended Applications: Resin bonded products, ceramic bonded and electroplated products; carbide, glass, ceramics, stone and other non-metallic materials.
应用推荐