静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.
静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.
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