在集成电路封装工艺过程中，对导电胶进行无氧化加热固化的质量直接决定了集成电路的质量和使用寿命。
During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.
在集成电路封装工艺过程中，对导电胶进行无氧化加热固化的质量直接决定了集成电路的质量和使用寿命。
During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.
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