随着集成电路制造工艺的飞速发展，人们已经可以将原先用各种电路搭建的板极系统集成在一块芯片上。
With the development of semiconductor process technology, nowadays a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
本研究对生产实际的指导意义在于，有效的提供了一种半导体集成电路制造工艺，能够同时提供纵向NPN晶体管，纵向PN P晶体管以及横向PN P晶体管。
The significance of this article is to propose an effective semi-conductor IC manufacturing process that provides vertical NPN, vertical PNP and lateral PNP transistors.
方形光二极管阵列包括四个集成在通用磷化铟（InP）衬底上的光二极管单片集成电路，采用低制造、集成与测试率的铟镓砷化物/磷化铟半导体工艺制造。
The Quad PD Arrays consist of four photodiodes monolithically integrated on a common indium phosphide (InP) substrate, and are fabricated using a low FIT rate InGaAs/InP semiconductor process.
硅片上互连线几何变异提取对于超深亚微米工艺节点下集成电路可制造性设计研究开发极其关键。
Interconnect geometric variation extraction is a key factor for the integrated circuit design for manufacturability research and development, under ultra deep sub-micro process nodes.
对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。
The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.
在大力发展IC制造技术的同时，各个集成电路企业不得不考虑如何管理好这工艺技术复杂，工艺精度高的企业的整体运作。
With the development of the IC manufacturing technology, the IC companies have to consider how to manage the whole operation of these high-tech and high-precision companies.
该肖特基二极管及其制造方法能够满足金属氧化物半导体工艺的需求，并适用于亚微米集成电路的集成生产。
The Schottky diode and the method of making same same can meet the requirements of metal-oxide-semiconductor process and be suitable for integrated production of sub-micro IC also.
这些工艺的标准性使得我们可以利用单独的硅制造厂生产集成电路。
The standard nature of these processes permits us to engage independent silicon foundries to fabricate our integrated circuits.
摘要：投影曝光工艺是集成电路制造过程中的关键环节，曝光系统的工艺水平已成为衡量微电子制造技术的重要标志。
Abstract: Lithographic exposure is the key process in the manufacture of integrated circuit, and the performance of exposure system decides the level of microelectronic manufacture technology.
投影曝光工艺是集成电路制造过程中的关键环节，曝光系统的工艺水平已成为衡量微电子制造技术的重要标志。
Lithographic exposure is the key process in the manufacture of integrated circuit, and the performance of exposure system decides the level of microelectronic manufacture technology.
尤其是近几年，由于制造工艺和手段的日趋成熟，使得高性能、高质量的新一代集成电路层出不穷。
Especially in lately years, Advanced manufacture technics and ways make higher capability and higher quality IC emerge in endlessly.
尤其是近几年，由于制造工艺和手段的日趋成熟，使得高性能、高质量的新一代集成电路层出不穷。
Especially in lately years, Advanced manufacture technics and ways make higher capability and higher quality IC emerge in endlessly.
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