制造集成电路需要将如半导体和金属等多层材料放置在硅片上。
Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.
Peak已经开发了半导体专利技术，使单一集成电路带宽扩音器代替高功率多路器组合扩音器成为可能。
Peak has developed proprietary semiconductor technology in which a single-ide bandwidth amplifier may replace multiple high-power multiplexer-combined-amplifiers.
方形光二极管阵列包括四个集成在通用磷化铟（InP）衬底上的光二极管单片集成电路，采用低制造、集成与测试率的铟镓砷化物/磷化铟半导体工艺制造。
The Quad PD Arrays consist of four photodiodes monolithically integrated on a common indium phosphide (InP) substrate, and are fabricated using a low FIT rate InGaAs/InP semiconductor process.
所有的电流(在所有的集成电路中)实际上局限于靠近半导体晶体面非常薄的区域内。
All of the currents (in virtually all integrated circuits) are confined to a very thin region near one face of a semiconductor crystal.
这是一个半导体集成电路。
IGCT是一种基于GTO结构并利用集成门极电路进行硬驱动控制的大功率半导体开关器件。
IGCT is a kind of high power semiconductor based on GTO structure, which achieves hard turn-off by the integrated gate circuit.
这种测试仪在电子玻璃、半导体、集成电路、薄膜和纳米技术等领域都具有很大的应用前景。
This kind of tester has a enormous practical prospect in many fields, such as electronic glass, semiconductor, integrated circuit, thin films and technology of nanometer.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
半导体器件。分立器件和集成电路。第8部分：场效应晶体管。
Semiconductor devices. Discrete devices and integrated circuits. Part 8: field-effect transistors.
介绍了一种使用新型测温集成电路ds1820和半导体致冷器件组成的简单精巧的温度测控系统。
This paper introduces a simple and easy temperature measuring and controlling system made up of a new -type temperature-measuring integrated circuit DS1820 and semiconductor refrigerator.
本文首次利用时域有限差分(FDTD)法分析了高速集成电路芯片内半导体基片上的有耗互连传输线的电特性。
A full wave analysis of lossy interconnection lines on doped semiconductor substrates in high speed integrated circuits is carried out by means of a finite difference time domain (FDTD) approach.
论述了特种气体在集成电路、太阳能电池、化合物半导体、液晶显示器和光纤预制棒等电子行业中的应用，并就其使用安全提出了建议。
This article introduces the application of specialty gases in electronics industries, such as integrated circuit, solar cell, compound semiconductor, TFT-LCD and optical fiber perform.
半导体可分为两类，即分离装置及集成电路。
Semiconductors can be classified into two categories - discrete devices and integrate circuits.
斯潘可控硅功率控制器集成了最新的半导体，冷却方式，固态发射电路。
Spang SCR power controllers incorporate the latest in semiconductors, cooling methods and solid-state firing circuitry.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路，一小片内含相互连接的微缩电路的半导体材料。
INTEGRATED circuit, a small piece of semiconductive material that contains interconnected miniaturized electronic circuits.
由于他们特殊的结构和微小的直径，可以被用于传感器装置、半导体或者集成电路的组件中。
Owing to their specialized structures and minute diameter, it can be utilized as a sensor device, semiconductor, or for components of integrated circuits.
本发明提出一种集成电路及金属氧化物半导体元件中判断漏电流的方法。
The present invention brings forward a method for determining leakage currents in integrated circuit and metal oxide semiconductor element.
半导体用于制作像二极管、晶体管以及集成电路等电子器件。
Semiconductors are used in the manufacture of electronic devices such as diodes, transistors, and integrated circuits.
利用铜代替铝作为超大规模集成电路的互连接线，代表了半导体工业的重要转变。
Shift from al to Cu interconnects in Ultra-Large Scale Integrate (ULSI) is important for semiconductor industry.
数字逻辑门电路作为集成电路被制造：所有组成的晶体管和电阻建立在一块半导体材料上。
Digital logic gate circuits are manufactured as integrated circuits: all the constituent transistors and resistors built on a single piece of semiconductor material.
本申请涉及用于半导体集成电路设备的缺陷分析方法和缺陷分析系统。
The invention relates to a defect analysis method for semiconductor integrated circuit devices and a defect analysis system.
因此，可以容易地制造包含薄膜集成电路的半导体器件。
Therefore, a semiconductor device including a thin film integrated circuit can be manufactured easily.
主要用于微电子行业，被广泛应用于半导体器件、集成电路等分装材料。
It is mainly used in microelectronic Industry. Widely used for the encapsulant of semiconductors and integrated circuits.
它的广泛报导集中在印刷电路、集成电路、连接材料、半导体、导线、粘结、钎焊、焊锡和焊接。
Its comprehensive coverage focuses on printed circuits, integrated circuits, contact materials, semiconductors, wire, bonding, brazing, soldering, and welding.
硅片是半导体器材的主要元件，在印刷集成电路及微型集成仪表中有着广泛应用。
The silicon chip is a main component of the semiconductor apparatus; there is extensive application in printing the integrated circuit and miniature integrated instrument.
芯片：集成电路或嵌入集成电路的小而薄的半导体，包含现代数字计算机的处理和记忆装置。
Computer chip: or chip; integrated circuit or small wafer of semiconductor material embedded with integrated circuitry, comprises the processing and memory units of the modern digital computer.
现代半导体集成电路的制造往往要求涉及大电流低能量带电搀杂剂原子的注入步骤。
The fabrication of modern semiconducting integrated circuits often requires implantation steps that involve high currents of low-energy charged dopant atoms.
现代半导体集成电路的制造往往要求涉及大电流低能量带电搀杂剂原子的注入步骤。
The fabrication of modern semiconducting integrated circuits often requires implantation steps that involve high currents of low-energy charged dopant atoms.
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