使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
所研制的微波陶瓷芯片电容器系列可广泛用于各种微波电路中。
Series of microwave ceramic chip capacitors developed in NSR can be used in various microwave circuits.
计算机芯片也有一个陶瓷底座。
芯片又是有很多材料组成，有金属、陶瓷、半导体、塑胶。
Microchips are also made up of a number of different materials: they contain metals, ceramics, semiconductors, and plastics.
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
芯片元件包括陶瓷衬底和至少一个辐射元件。
The chip component comprises a ceramic substrate and at least one radiating element.
该芯片天线被制造为金属化的陶瓷基板的，类似的基于芯片的SAW滤波器，双工器，或定向耦合器。
The chip antenna is fabricated with metallization of a ceramic substrate, similar to chip-based SAW filters, diplexers, or directional couplers.
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
这两款芯片安装在陶瓷基板，然后密封在一个密封的陶瓷表面贴装封装。
The two chips are mounted on a ceramic substrate, and then hermetically sealed in a ceramic surface mount package.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
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