本文综述了适用于陶瓷与金属连接的各种方法，重点介绍它们的原理、特点、适用范围、最新进展及工程应用。
A number of available bonding processes are introduced in this review, and the emphases are placed on their principles, characteristics, limitations, latest progress and application in engineering.
陶瓷与金属的连接技术是材料工程领域的热点研究课题，而扩散连接方法被认为是陶瓷与金属连接最适宜的方法。
The bonding technique of ceramics to metals is one of the central issues in materials engineering, and diffusion bonding is considered to be the most suitable method for bonding ceramics to metals.
在陶瓷与金属间用一定厚度的成分和结构呈梯度变化的梯度过渡层作为连接二者的焊缝层，是解决陶瓷与金属连接时所存在问题的较好措施之一。
The problem may be solved by using the gradient transitional layer, within which the composition and microstructure can vary gradiently, as a weld interlayer between ceramic and metal.
陶瓷与金属组成的复合构件具有广阔的应用前景，而陶瓷与金属的连接技术是陶瓷工程应用的关键。
Ceramic - metal composite components have a wide application prospect, and the bonding technology of ceramics to metals is a key to the practical application of ceramics to engineering.
陶瓷基复合材料是一种新兴的热结构材料，解决其自身及其与金属的连接工艺，是实现其推广应用的重要课题之一。
Ceramic matrix composites (CMCs) is one of newly developed thermal-structured materials. Self-joining of CMCs and its joining to metals become an important task to facilitate their application.
实验证明：双螺母加弹性元件的连接方案能满足陶瓷与金属的可靠连接。
The test demonstrates that the arrangement of double nuts with an elastic element is very successful in providing a reliable connection for ceramics and metal.
阳极键合是一种利用电和热相互作用实现固体电解质玻璃(陶瓷)与金属材料固态连接的一种新方法。
Anodic bonding is a new way to realize the bonding between solid electrolyte glasses (ceramics) and metals through the interaction process of electricity and heat.
本文从上述连接方法的原理设计、连接材料设计与制备、接头性能及各自的优缺点等方面综述了陶瓷与陶瓷或金属低温连接研究的现状。
This paper gives a review of development in this research area, covering the aspects of design principles of bonding methods, bonding materials development, joints, properties, their advantage…
本文从上述连接方法的原理设计、连接材料设计与制备、接头性能及各自的优缺点等方面综述了陶瓷与陶瓷或金属低温连接研究的现状。
This paper gives a review of development in this research area, covering the aspects of design principles of bonding methods, bonding materials development, joints, properties, their advantage…
应用推荐