介绍了导电漆、作为导电填料的片状镀银铜粉的制备工艺流程。
The preparation process flow of conducting paint and silver plated flake copper powder as conducting filling were introduced.
分别研究了漆膜表面单位电阻与镀银铜粉的含量及其粒径以及钛酸酯偶联剂的含量之间的关系。
The relationship between the surface's unit resistance of the film with contents of silver plated copper powder and its particle size, and the contents of coupling agent were studied.
采用化学沉积法在微米级铜粉上镀银，并对得到的镀银铜粉的性能进行测试，对得到的结果进行了分析。
Silver-copper powder was prepared by plating silver on micron sized copper powder, its properties were examined, and the test results obtained were then analyzed in this discussion.
通过单因素实验确定了导电胶的最佳配方：镀银铜粉填充量为70%、复合光引发剂用量为4%、热引发剂aibn用量为2%、偶联剂KH570用量为2.5%。
The optimal formula of the UV curable conductive adhesive gained from single factor test was as follows: Silver-plated copper powder 70%, complex photoinitiator 4%, AIBN 2% and KH570 2.5%.
通过单因素实验确定了导电胶的最佳配方：镀银铜粉填充量为70%、复合光引发剂用量为4%、热引发剂aibn用量为2%、偶联剂KH570用量为2.5%。
The optimal formula of the UV curable conductive adhesive gained from single factor test was as follows: Silver-plated copper powder 70%, complex photoinitiator 4%, AIBN 2% and KH570 2.5%.
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