介绍了一种焦磷酸盐镀铜溶液中铜、总焦磷酸根、磷酸根、柠檬酸铵含量的分析方法和计算方法。
An analytical procedure and calculation method on the content of copper, total pyrophosphate, phosphate and ammonium citrate in pyrophosphate copper plating bath were given.
本文采用镀铜铂电极和暂态恒电流阶跃的方法测得了铜物显（铜物理显影）体系的极化曲线。
The polarization curves of copper physical development (CuPD) system were obtained by transient constant current step method on copper plated platinum electrode.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
研究比较了两种化学方法——铁粉法和甲醛法在石墨粉表面镀铜的工艺。
The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.
分析了氰化镀铜锡合金过程中镀层出现毛刺弊病的原因，并提出了解决方法。
The case of burrs defective in cyanide tin - copper alloy deposits were investigated and preventive methods were proposed.
同时试验了一种破络沉淀铜的方法处理无氰络合物镀铜废水。
A method for breaking the complex forming copper precipitation was tested for wastewater treatment of non-cyanide complex copper plating.
介绍了酸性镀铜光亮剂的组成、常用的中间体及其作用以及复配方法。
In this paper, the composition of acidic copper brightener, the normally used intermediates, their functions and composition methods are introduced.
采用化学镀的方法制备镀铜和镍导电涤纶织物。
Conductive Poly (ethylene terephthalate) (PET) fabrics were prepared by electroless copper and nickel plating.
用电化学方法和扫描电子显微镜研究了钢铁置换镀铜反应及镀层形貌，结果表明：钢铁表面的置换铜镀层总是多孔的。
The reaction of chemical replacement copper plating on iron surface and profile of the coating have been investigated by electrochemical methods and scan electron microscopy.
本发明还提供一种铜 基减摩复合粉末的制造方法，包括：A。制备化学镀铜包覆石墨粉步骤；
The invention also provides a manufacturing method for copper-based antifriction compound powder which comprises: A. the step of preparing chemical copper plating coating graphite powder;
本发明还提供一种铜 基减摩复合粉末的制造方法，包括：A。制备化学镀铜包覆石墨粉步骤；
The invention also provides a manufacturing method for copper-based antifriction compound powder which comprises: A. the step of preparing chemical copper plating coating graphite powder;
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