文章提出，为了适应市场需求，必须建设能生产汽车用镀层板的新生产线。
It is pointed out that new production lines to provide hot-dip galvanizing sheet for automobile should be constructed so as to meet the market needs.
指出我国热轧宽带钢生产能力已能满足国内需求，并可能出现过剩，但转化为冷轧板带和涂镀层板比例太低。
The production capacity of hot rolled wide strip has already meet the need in China, even maybe overplus. The transfer rate of hot rolled wide strip into cold rolled one and coated sheet is small.
与热轧相比，冷轧厂的加工线比较分散，冷轧产品主要有普通冷轧板、涂镀层板也就是镀锡板、镀锌板和彩涂板。
Compared with hot-rolled, cold-rolled plant processing lines scattered, cold-rolled products are mainly common cold-rolled plates, Tudu laminates is Tinplate, galvanized plate and Cai Tuban.
成功的试制成了覆盖有镍-铁-金刚石复合电刷镀层的钢球研磨板。
Finally steel balls millstone covering with Ni-Fe-diamond composite electro-brush plating film is produced successfully.
采用先进的镀层后处理工艺，包括采用拉伸弯曲矫直机改善板形处理，采用光整机改善镀层表面和机械性能。
An advanced post coating treatment is adopted, including shape improvement by tension leveller, coating surface and mechanical property by skin pass mill.
采用先进的镀层后处理工艺，包括采用拉伸弯曲矫直机改善板形处理，采用光整机改善镀层表面和机械性能。
An advanced past coating treatment is adopted, including shape improvement by tension leveller, coating surface and mechanical property by skin pass mill.
多层印制板的制作是一个生产工序复杂且周期很长的过程，那么造成金属化孔镀层空洞的原因也就很复杂。
Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex.
轧后带钢表面清洁度对普板表面及锌板镀层均有严重不良影响。
After rolls over the hoop surface cleanliness has to the Pu board surface and zinc plate coating seriously affects not good.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
镀层延展性好，平整、外观良好，可用于印制线路板的孔金属化及其它塑料电镀。
It can be used to metalize holes of PCB and plate on plastics.
镀层延展性好，平整、外观良好，可用于印制线路板的孔金属化及其它塑料电镀。
It can be used to metalize holes of PCB and plate on plastics.
应用推荐