配位共价键是其中两个键合电子均来自该键所涉及的原子之一的键。
A coordinate covalent bond is one where both bonding electrons are from one of the atoms involved in the bond.
这个这儿的区域指的的了键合区域。
科学家们忙于填补元素周期表的空白、探索未知的原子现象(如放射性和键合)。
Boffins were busily filling in the blanks in the periodic table and probing unknown atomic phenomena (like radioactivity and bonding).
s和1s上两个电子组成的键合电子成椭圆形,这是成键，这是反键电子，这些是刚刚已经画过的能级,我也给你们画了。
s plus 1s gives you this oval ellipsoid which is the bonding, and here are the antibonding, and then these are the energy levels that I have been drawing for you.
按Ctrl +1组合键并选择Pickoutselectedpartof String。
以此为基础阐述了建立平面多体机械系统键合图模型的一般方法及其动力学原理。
Based on this, the generic procedure of modeling planar multibody mechanical systems by bond graphs and its dynamic principle are described.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
文中提出的功率键合图建模方法能够较好地完成对人体循环系统建立仿真模型的工作，并对一个简化的循环系统生理模型进行了计算机仿真研究。
In this paper, the Power Band Graph (PBG) modeling method is used to realize modeling of the human circulation system and conduct a simulation study on a simplified physiological system model.
聚乙二醇键合相已用于高效疏水作用色谱分离活性蛋白质。
The polyethylene glycol (PEG) beaded phase has been employed for biologically active proteins by high performance hydrophobic interaction chromatography.
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。
The model and the simulation results can be the reference in design of bonding process.
在MEMS器件的设计与加工过程中，键合技术是体硅工艺的一项关键技术。
In the design and fabrication of MEMS devices, MEMS fabrication process based on Silicon is a main technology, to which is deeply paid attention by researchers and industries.
研究结果指出，接触法炭黑与氧化炉法炭黑的表面在碳氧键合结构形式及含量上有很大的差异；
The differences in structural type and contents of carbon-oxygen single bond between the contact black and the furnace black are very evident.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
分析了键合强度与键合温度之间的关系。
The relationship of bonding strength and temperature are investigated.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
超声功率是影响粗铝丝引线键合强度的最主要因素之一。
The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.
阐述了建立空间多体系统键合图模型的一般方法及其动力学原理。
The method of modeling spatial multibody systems by bond graphs and its dynamic principle are described.
BP网络用于金丝键合质量的预报具有可行性和有效性。
That BP network used for predicting quality of wire bonding is feasible and valid.
键合是微流控芯片制作的关键技术之一。
Bonding is one of key processes for fabrication of microfluidic chip.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
固体酸是将酸性基团键合或负载于不溶性载体上的一类催化剂。
Solid acids are a series of catalysts that acidic groups were bonded or supported on unsolvable supporters.
这些实验现象和分析结果为后期的键合参数匹配规律和系统动态特性研究打下基础。
These experiment phenomena and analysis results are useful to the research of parameters match and dynamic feature of system in the future.
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.
认为这些平面氢键可以通过进一步键合来形成硬段微区中的三维氢键。
Three dimensional hydrogen bonding in hard segment domains can be formed by further bonding of the above planar hydrogen bondings.
最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。
Finally experiments of anodic bonding and Au-Si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.
针对一种用键合线连接的简单封装模型进行射频性能的模拟。
The RF characteristics of bonding wire interconnection in a simple package model were simulated.
针对一种用键合线连接的简单封装模型进行射频性能的模拟。
The RF characteristics of bonding wire interconnection in a simple package model were simulated.
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