粘接的结果增强了交联键强度，而降低了在压力、拉力和剪切力作用下，比较容易分离的现象。
This results in a much stronger bond that lasts longer and is much less susceptible to separation under compressive, tensile and shear forces.
从结合能、C O键长、轨道布居、态密度等方面比较了C与金属成键强度及CO分子被活化程度。
The chemisorption properties, including the length of CO bond, orbital population and density of states, are computed and analyzed respectively.
这个属性不影响排序键的长度，除非还增加了强度级。
Sort key length will not be affected unless the strength level is also increased.
将强度属性设置为更高的级别会增加排序键的长度。
Setting the strength attribute to a higher level will increase the length of the sort keys.
碳结构的强度来源于碳原子(想想金刚石)间强大的化学键。
The strength comes from the powerful chemical bonds that form between carbon atoms (think diamond).
或者如果我们看键的强度的话，它实际上比单键更强，而比双键更弱。
Or if we look at how strong it is, it's actually stronger than a single bond, but weaker than a double bond.
神经元组形成庞大的网络，通过改变细胞之间神经键的强度，达到处理信息和学习的目的。
Groups of neurons form vastly interconnected networks, which, by changing the strength of the synapses between cells, can process information, and learn.
因此实际上我们可以直接进行比较，对氮分子与氢分子的离解能，或键的强度。
So what we can actually directly compare is the dissociation energy or the bond strength of nitrogen versus hydrogen.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
机械地说，我们记忆信息的能力可以归结为大脑中神经元之间连接的强度，神经元通过神经键连接。
Mechanically speaking, our ability to recall information comes down to the strength between neurons in our mind, which are connected by synapses.
这种强度来自于碳原子间的化学键：这也是金钢石之所以坚固的原因。
That strength comes from the chemical bonds between carbon atoms: the same sort that give strength to diamonds.
结果表明：基板内部的银导体不存在迁移现象，导体的附着力、键合强度以及基板的绝缘电阻等性能均比较理想。
The results show that there is not any evidence of silver migration within LTCC construction, and conductor adhesive force, wire-bonding strength and insulation resistance are high.
键材料的强度足够。
超声功率是影响粗铝丝引线键合强度的最主要因素之一。
The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.
其实，还有另外一种画这个曲线的方式，可以直接画出离解能的大小，或者键的强度。
So, there's actually another way to graph it where we can directly graph the dissociation energy or the bond strengths.
我的灯安装在包括四个灯的边缘光高强度：两个灯，一键轻，一个环境补光。
My light setup included four lights: two lights at high intensity for the rim light, one key light, and one ambient fill light.
计算量子点分子中束缚能级之间跃迁的振子强度表明，只有成键态和相应的反键态之间跃迁才是允许的。
And the bound state with the highest energy level in the quantum-dot molecule changes gradually into a quasibound state when the electric field strength increases.
本文介绍了某微波组件芯片剪切力和键合强度的改进案例。
In this paper, an improvement example of die shear strength and bond strength of a microwave module is introduced.
第9步后，系统验证了新的密码强度，得到的密码重置，并提示你按任意键退出密码重置工具。
Step 9 After the system verifies the strength of the new password, the password gets reset, and you get prompted.
讨论离解能的另外一种方式，是直接称它为键的强度，它们是一样的，彼此相等。
So, another way to talk about dissociation energy is simply to call it bond strength, it's the same thing, they're equal to each other.
在超声引线键合过程中，键合力是影响键合强度的重要因素之一。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
结果表明，苯环与铂原子之间有很强的成键作用，并随着游离氢原子和水分子的参与，作用强度有很大变化。
It was found that there existed a strong bonding interaction between Pt and benzene, and the bonding strength changed with the participation of hydrogen and water.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
分析了键合强度与键合温度之间的关系。
The relationship of bonding strength and temperature are investigated.
最后，进行了阳极键合、金-硅键合试验，研究了试验中影响键合强度的关键因素，提出了较为可行的键合工艺。
Finally experiments of anodic bonding and Au-Si bonding have been carried out to find out the key factors related to the bonding strength, and the most feasible bonding manners are put forward.
试验研究了不同超声功率条件下，键合时间对粗铝丝引线键合强度的影响规律。
The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions.
拉伸模拟表明，由于这些层间键不导致碳纳米管的显著结构破坏，因此它们不会导致多壁碳纳米管拉伸强度的显著降低。
Tensile testing show that the tensile strength is not noticeably reduced because these interlayer bonds do not lead to the abrupt damage of the MWCNT structure.
而当我们讨论共价键的时候，有两点特性是我们最关注的，那就是键的强度，或者说成键之后能量降低了多少。
And when we talk about covalent bonds, there's 2 properties that we'll mostly focus on, and that's going to be thinking about the bond strength or the energy by which it stabilized when it bonds.
硅片键合强度达到了体硅的强度。
硅片键合强度达到了体硅的强度。
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