高级精密焊接纯锡铅合金材料制品。
High precision welding materials pure tin lead alloy products.
总结了电镀锡、锡铅合金和锡铋合金的分类、特点及应用情况。
The classification, characteristics, and application results of tin, tin lead and tin bismuth electroplating were summarized.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
我听说盘子是由锡铅合金制成的，番茄中的高酸物质会使盘子中的铅污染食物，引起中毒。
B - I heard plates were made of pewter and the high acid content of the tomato caused lead from the plate to poison the food.
许多电子制造商将在2006年前从传统的锡铅合金钎焊工艺改变为无铅合金的钎焊工艺。
Many electronics manufacturers will transition their soldering processes from traditional tin-lead alloys to lead-free alloys before 2006.
然后，他们从第六街区“进口”几只锡铅合金的杯子和一两个烘锅，这就成了他们的“据点”。
Then they imported some pewter mugs and a chafing dish or two from Sixth Avenue, and became a "colony".
随着电子产品制造寻求使电子互连无铅很多人都在找纯锡焊和涂层作为一个经济的替代传统的锡铅合金。
As electronics manufacture seek to make electronic interconnectio lead-free, many are looking at pure tin soldering and coating as an economical alternative to traditional tin-lead alloys.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
Cu and Pb ions in the alloy plating bath and composition of its deposits.
介绍了叠层片式电感三层端头电极即银基底电极、镍层、锡-铅合金镀层的性能及制备工艺。
Properties and preparing process of tri layer films with Ag base coating, Ni electrodeposit, Sn Pb alloy for terminal electrode of multilayer chip inductor were described.
MLCI端头电极锡-铅合金电镀工艺及维护、镀后的清洗、MLCI的储存影响镀层的耐焊性和可焊性。
Solderability of Sn Pb alloy deposit is determined by electroplating process and its maintenance, post treatment rinsing, storage of MLCI, etc.
对锡-铅合金镀层的耐焊性和可焊性进行了检验以获得合格的MLCI产品。
Therefore, solderability of Sn Pb alloy deposit was tested for qualified MLCI products.
第一软金属层和第二软金属层采用锡合金或铅合金材料。
The first soft metal layer and the second soft metal layer are made of tin alloy or lead alloy.
第一软金属层和第二软金属层采用锡合金或铅合金材料。
The first soft metal layer and the second soft metal layer are made of tin alloy or lead alloy.
应用推荐