在锡膏印刷过程中，印刷机是印刷品质控制的关键。
Screen printing equipment is the key of quality control during the printing course.
在第二阶段，在优化设计区间中利用响应曲面法建立锡膏印刷过程的精确模型。
On the second phase, response surface method is adopted to build the accurate models in the reduced parameter ranges.
在锡膏印刷工艺中，锡膏、丝印机、锡膏使用方法和印刷工艺过程将影响到印刷质量。
Solder paste, screen printing, use ways, printing process course will decide the printing quality.
讨论了电子产品s MT制造过程中如何在产品高质量的基础上实现锡膏印刷的高生产量。
The paper discusses the SMT process of solder paste printing for electronic product with high throughput and high-quality.
阐述了锡膏印刷工艺参数，印刷周期，操作软件的易用性，以及清洗、检验等附加工序对实际生产量的影响。
It specifies the influence of the parameters of solder paste printing, printing cycle, ease operation of software and additional steps of cleaning and inspection on improving the quality of products.
本文简述了锡膏印刷的工艺流程，分析印刷过程中造成的相关缺陷及其产生的原因，并提出了相应的解决方法。
This article introduces the process of solder paste technical printing, analyses the interrelated disfigurement in printing and cause, and puts forward the relevant solvent.
设计机构单独测试、机构故障自诊断，机构故障自恢复等智能化控制功能，提高锡膏印刷机控制系统的稳定性、可靠性。
Provide device separate test, fault diagnose, system self resume and some other functions to improve the stability, reliability and automatic control intelligence of stencil printer.
表面贴装，钢网是锡膏准确重复印刷的关键。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
比率低于66%，锡膏转移的效率降低，印刷质量变差。
As the ratio decreases below 66 percent, paste transfer efficiency decreases and print quality becomes erratic.
刮刀卫士，彻底清洗你的刮刀，还你一个清洁、干净的印刷环境，锡膏污染、钢网堵塞问题大大降低了。
Squeegee Bodyguard can thoroughly clean your squeegees and return a clean and tidy printing environment to you. Occurrences of solder paste pollution and steel mesh blocking will be greatly lowered.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
丝网印刷在双面印年刷电路板（ PCB）工艺中起着重要作用，最关键的环节是要掌握好网印到PCB焊盘上锡焊膏的量，要做到这一点，需要综合控制好多种工艺因素。
The key factor is the proper amount of tin solder to be screen printed onto welded surface of PCB. To do this well, it's necessary to control several technological factors.
重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
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