锡焊件、铅锡合金、锌压铸件、铍青铜、磷铜等合金在电镀前也常用预镀铜来改善结合力。
Tin welding parts and lead-tin alloy die casting, zinc, beryllium bronze, phosphorus copper alloy in electroplating copper with commonly used before also gets to improve adhesion.
研究了一种新型可焊性光亮锡锑合金电镀工艺的镀液配方和电镀操作条件；
A new electroplating technology of solderable bright Sn-Sb alloy of bath components and operating conditions were studied.
对锡-铅合金镀层的耐焊性和可焊性进行了检验以获得合格的MLCI产品。
Therefore, solderability of Sn Pb alloy deposit was tested for qualified MLCI products.
适用于铜材的焊接，例如铜和锡铜合金，尤其是用于铜锌合金和钢的连接焊。
Suitable for welding of copper materials, for example copper and tin bronzes , especially used for joining of copper zinc alloys and steels.
MLCI端头电极锡-铅合金电镀工艺及维护、镀后的清洗、MLCI的储存影响镀层的耐焊性和可焊性。
Solderability of Sn Pb alloy deposit is determined by electroplating process and its maintenance, post treatment rinsing, storage of MLCI, etc.
随着电子产品制造寻求使电子互连无铅很多人都在找纯锡焊和涂层作为一个经济的替代传统的锡铅合金。
As electronics manufacture seek to make electronic interconnectio lead-free, many are looking at pure tin soldering and coating as an economical alternative to traditional tin-lead alloys.
本发明公开了一种无铅无卤素锡焊膏，包括以下重量份组分：合金粉 80-98，助焊剂2-20；
The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20;
本发明公开了一种无铅无卤素锡焊膏，包括以下重量份组分：合金粉 80-98，助焊剂2-20；
The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20;
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