银镀层变色不仅影响镀层的外观，更重要的是影响镀层的导电性能。
Silver plating color variation affects not only its outlook but also its electricity conductibility.
研究结果表明选择带电入池，无冲击电流方式时，可增强银镀层的结合力。
The result showed that the mode of sample entering electroplating bath with electrification and without impact current could made the adhesion harder.
结果表明，金刚石粒子的加入能有效提高银镀层的耐磨性和电接触使用寿命。
Results show that silver deposits are greatly improved in wear resistance and service life of electric contact.
通过试验，找到了不合格镀银件镀层的回收方法，确定了银镀层的回收和利用工艺。
The methods for the recycle of silver from discarded silver electroplated wares were investigated, and the processes for the recycle and utilization of the silver coating were established.
通过化学镀可在碳纳米管表面镀上一层连续的银镀层，以增强碳纳米管与金属基体的界面结合力。
Through electroless plating carbon nanotubes were coated with a continuous layer of silver, which will increase interfacial strength between carbon nanotubes and metal-matrix.
以镀层表面形貌和显微硬度为考核指标，采用正交试验法优选了脉冲镀银参数，采用优选的脉冲参数电镀与直流电镀的银镀层作了比较。
Acoording to the surface appearance and the microhardness of coating, the parameters of silver plating with pulse current are optimized by the orthorhombic experiment.
介绍了银-锑合金镀层和镀液中锑含量的分析方法。
This paper introduces the analysis method of silver-antimony alloy coating and antimony content.
介绍了叠层片式电感三层端头电极即银基底电极、镍层、锡-铅合金镀层的性能及制备工艺。
Properties and preparing process of tri layer films with Ag base coating, Ni electrodeposit, Sn Pb alloy for terminal electrode of multilayer chip inductor were described.
重点研究了渗透压对化学镀共沉积钯银的沉积速度、镀层组成和膜表面结构性能的影响。
More attention was focused on the effects of osmosis on the deposition speed, compositions, surface structure properties of the simultaneously deposited Pd-Ag alloy top layer by electroless plating.
提出银件镀金、镀铑工艺流程和配方，介绍了金合金镀金工艺、镀前处理、操作要点，强调中间镀层能有效防止银基体的腐蚀和镀件变色。
To study the effect of surface treatment such as titanium nitrogen(TiN) coating and gold-plating on corrosion resistant of Ni-Cr alloy and Ni-Cr Alloy With Titanium.
镀层具有良好的可焊性和导电性，其电极损耗低于银电极损耗，可作为代银接触镀层。
Ni B plating possesses good weldability and conductivity, and the electrode loss is lower than that of silver electrode. It may be used instead of silver plating.
金属件及插脚均可镀上不同镀层，如银，24K金，铂金等。
Metal components and pins can be in different plating like silver, 24k gold, platinum.
金属件及插脚均可镀上不同镀层，如银，24K金，铂金等。
Metal components and pins can be in different plating like silver, 24k gold, platinum.
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