然而，在另一个阳极电位更正的阳极溶解过程中，观察到在表面形貌上产生明显变化的原因是金锡合金的溶解。
However, at more anodic potentials another dissolution process was observed producing noticeable changes on the surface morphology which could be ascribed to the dissolution of a au-sn surface alloy.
作为目前广泛使用的耗时长的固体贴装预制件的代替品，一种用电镀共沉积得到的金锡合金共晶焊料被用于该项研究中。
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic au-sn alloy was used in this study.
通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
鞋面用银、金或铅锡合金的金属丝装饰。
The uppers were embroidered with silver, gold or pewter wire.
[4] 宋佳佳， 郭德燕，邓超，等。孕育形核处理对金锡共晶合金铸态凝固组织的影响[J]。稀有金属材料与工程， 2013，42（4）：756-760。
SONG J J, GUO D Y, DENG C, et al. Effect of incubated nucleation treatment on solidification microstructure of Au-Sn eutectic alloy[J]. Rare Metal Materials and Engineering, 2013, 42(4):756-760.
[4] 宋佳佳， 郭德燕，邓超，等。孕育形核处理对金锡共晶合金铸态凝固组织的影响[J]。稀有金属材料与工程， 2013，42（4）：756-760。
SONG J J, GUO D Y, DENG C, et al. Effect of incubated nucleation treatment on solidification microstructure of Au-Sn eutectic alloy[J]. Rare Metal Materials and Engineering, 2013, 42(4):756-760.
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