因此，研究者们转而使用两层含石墨的导电性聚碳酸酯，各层的内外层都附有一条金属带。
So instead the researchers use two layers of graphite-rich conductive polycarbonate, each flanked by a single metal strip in the inner and outer cladding.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
试验探棒还需穿过在表面覆盖一层非导电涂层如瓷釉或清漆的接地金属外壳的开口。
The test probe is also applied through openings in earthed metal enclosures having a nonconductive coating such as enamel or lacquer.
与其它导电金属层相比，镀铜层具有应力小、机械强度高、塑料基体与镀层结合力好等特点。
Compared with other conductive metal layer, copper coating with small with stress, high mechanical strength, the plastics substrate and coating binding force is good wait for a characteristic.
在铁磁体上存在至少一个其他金属层(198)，其被布置为第二组相邻非交叉导电部分。
At least one other metal layer (198) is on the ferromagnetic-based body and arranged as a second set of adjacent non-intersecting conducting segments.
屏蔽层的导电率是由连同半导电层所采用的金属带或线的截面积和电阻率所决定的。
Shielding layer conductivity is made together with the semiconductive layer adopts metal strip or wire cross-sectional area and the resistivity is determined by the.
一金属绝缘金属电容，包含有一第一平板电极、一第二平板电极以及一第二层间导电接孔。
The metal-insulator-metal capacitor comprises a first plate electrode, a second plate electrode and a second interlayer conductive joint hole.
所述的具有金属铜表面的基底材料是指金属铜片以及表面镀了一层纳米金属铜的导电玻璃ito。
The base material provided with metallic copper surface is a sheet copper and conductive glass ITO with metallic copper plated on surface.
插座外壳包括利用金属屏蔽层进行金属化的不导电衬底。
The jack housing includes an electrically non-conductive substrate metallized with a metal shield layer.
金属薄膜11的表面被透明氧化物薄 膜10、12覆盖的叠层结构的透明导电膜。
There is provided a transparent conductive film of laminate structure comprising metal thin-film (11) whose surfaces are covered by transparent oxide thin-films (10,12).
CVD金刚石膜表面被预先涂覆一层导电金属，然后采用电蚀方法对该表面进行加工，使金刚石膜突起的尖峰被迅速去除。
Diamond film is coated with a thin layer of conductive material in advance, and then EDM method is used to machine the coated surface.
湿蚀刻：对于金属层和ITO导电层使用湿蚀刻进行蚀刻。
Wet etching: Use wet etching for metal layer and ITO conductive layer.
湿蚀刻：对于金属层和ITO导电层使用湿蚀刻进行蚀刻。
Wet etching: Use wet etching for metal layer and ITO conductive layer.
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