实际应用-钛酸钙可用于制备防腐漆，来保护金属基板不受腐蚀。
Practical implications -calcium titanate can be utilised for the preparation of anticorrosion paints to protect metal bases from corrosion.
接下来，在金属基板上添加一种由两种聚合物组成的混合物来制作样品，这个工艺过程被称为嵌段共聚物光刻(BCP)。
Next, a mixture of two polymers is added to the metal substrate to create patterns, a process known as diblock copolymer lithography (BCP).
无背板生长法是利用SU - 8光刻胶，通过低成本的UV -LIGA技术，直接在金属基板上电铸镍图形来实现的。
No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.
这种电路的基板材料也非常平滑，在这个电路的下次是由聚合物-金属-聚合物这种类似三明治的夹心结构组成的。
The backing material must be as smooth as possible, and the circuitry sealed beneath a layer composed of a polymer-metal-polymer sandwich.
但一些科学家仍致力于改进借助过渡金属基质的石墨烯生产方法，比如说借助铜箔基板。
A number of scientists, yet, are focussing on the improvement of graphene growth over transition metal substrate such as copper foil substrate.
如果基板是金属，如可能我就喷砂或者，作为第二选择80粒度的金刚砂纸。
If the substrate is metal, I sand blast it when possible or use 80 grit emery paper as a second choice.
概述微点焊接的工作原理和技术特点，以及用于薄膜铂电阻温度传感器中的薄膜基板上细小金属引线的微点焊技术。
This paper summarize principle and technical characteristics of precession welding machine, and emphases on precession welding technics of thin metal wire on pellicular PCB base?
压型金属板成型后，其基板不应有裂纹。
Pressing sheet metal forming, its substrate should be crack.
图像形成基板还包括设置在发射区上的金属层和设置在至少一个非发射区上的至少一个电子收集器。
The image forming substrate further comprises a metal layer positioned on at least the emission regions, and at least one electron collector positioned in the non-emission region.
介绍了MCM-C的CAD设计方法，以及MCM-C基板的制作与金属化、芯片的测试和老化、芯片互连等工艺。
This paper describes the CAD method for MCM-C, the fabrication and metallization processes of MCM-C substrates, and the technologies for die test, burn-in and interconnection.
多层共烧氮化铝陶瓷是采用厚膜印刷的方式将多层的电路金属化做入氮化铝基板并在特定气氛中高温烧结的一种高性能陶瓷。
Multilayer co-fired AlN ceramic is a type of high performance ceramic that is printed in thick film to form multilayer circuit and fired in a certain atmosphere in high temperature.
一种用于半导体发光器件的安装基板包括具有第一和第二相对金属表面的固体金属块。
A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces.
提出了在介质基板间加入金属脊和在贴片上加h形调谐枝节的新方法。
A new method of putting metal-ridge into substrates and putting H-shaped tuning stub on the patch to increase band was proposed.
实验发现，在液相粘度较高、表面张力大，熔体材料不浸润固相颗粒和基板等因素的影响下，烧结过程中出现了球化现象。球化的出现妨碍了直接金属激光烧结成形的顺利进行。
During the laser sintering, due to the large liquid phase viscosity and surface tension, the balling effect occurred when the molten did not wet the solid metal particle and the underlying substrate.
在一实施例中，此方法包含在一基板上形成半导体氧化层以及在半导体氧化层上形成一金属氧化物层。
In one embodiment, the method includes forming a germanium oxide layer over a substrate and forming a metal oxide layer over the germanium oxide layer.
可挠性基板中的金属作为阻隔层而使氧及蒸汽渗透到OLED减至最小。
The metal in the flexible baseboard as obstruct layer makes oxygen and vapor impregnate the OLED to minimum.
所述基板背对所述镜头模组的表面上设置有至少一个外接点，所述外接点与所述金属接点相接触。
The surface of the substrate, which is opposite to the camera module, is provided with at least one external contact, and the external contact is contacted with the metal contact.
该芯片天线被制造为金属化的陶瓷基板的，类似的基于芯片的SAW滤波器，双工器，或定向耦合器。
The chip antenna is fabricated with metallization of a ceramic substrate, similar to chip-based SAW filters, diplexers, or directional couplers.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
本发明公开了一种旋转编码开关，包括：一个设有金属接触点极的绝缘基板、上盖和旋转开关本体；
The invention discloses a rotary coding switch comprising : an insulted substrate installed with metal contact point pole, upper cover and rotary switch body;
研究了不同的表面处理方法对基板金属化剥离强度的影响规律。
The effect of different surface treatment on peel strength of substrate has been investigated.
本发明提供一种能够将金属轧制板整体作为基板用材料进行使用，并能够较高地维持制造成品率的压模用基板的制造方法。
A process for producing a stamper substrate in which a rolled metal sheet can entirely be used as a substrate material to thereby enable maintaining high production yield.
金属层可包含钼金属，且形成于基板的该粗糙面上。
The metal layer can comprise molybdenum metals and is formed on the rough surface of the substrate.
所述方法是：在硅基板的表面采用金属1、金属2和金属3三层金属布线；
The method is as follows: the surface of a silicon substrate adopts the three-layer metal wiring of metal 1, metal 2 and metal 3;
真空镀金涂层涉及金属加热到其沸点在真空室，然后让凝结在基板上沉积金属=表面。
Vacuum Metallizing Involves Heating The Coating Metal To Its Boiling Point In A Vacuum Chamber, Then Letting Condensation Deposit The Metal On The Substrate=S Surface.
真空镀金涂层涉及金属加热到其沸点在真空室，然后让凝结在基板上沉积金属=表面。
Vacuum Metallizing Involves Heating The Coating Metal To Its Boiling Point In A Vacuum Chamber, Then Letting Condensation Deposit The Metal On The Substrate=S Surface.
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