本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。
The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
在外壳上用油墨印刷各种花色图案的金属化塑料薄膜层直接粘贴上，完成了外壳的装饰作用。
The outer casing is pasted with a metallizing plastic film layer with various colors and patterns printed by ink to accomplish the decorative effect of the outer casing.
天线振子被施加到光盘基底，作为在金属化数据区上的图案化天线层，并能与数据区电绝缘。
The antenna element(s) can be applied to the disk substrate as a patterned antenna layer over a metallicized data region, and can be electrically isolated from the data region.
天线振子被施加到光盘基底，作为在金属化数据区上的图案化天线层，并能与数据区电绝缘。
The antenna element(s) can be applied to the disk substrate as a patterned antenna layer over a metallicized data region, and can be electrically isolated from the data region.
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