一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
该防焊层形成于该可挠性介电层上，以局部覆盖该些引脚，并依不同应用可覆盖或显露该补强金属图案。
The solder mask layer is formed on the flexible dielectric layer to locally cover the pins and to cover or expose the reinforced metal patterns according to different application.
对要求接地屏蔽的外壳，应用可焊性好的金属材料或铵层。
On requirements of grounding shielding enclosure, using good solderability of metallic material or layer of ammonium.
铜和铜合金具有优良的导电性、导热性和可焊性，是目前应用最广的金属材料之一。
Copper and copper alloys are one of the most widely used metals due to their excellent electric conductivity, heat conductivity, and welding ability.
铜和铜合金具有优良的导电性、导热性和可焊性，是目前应用最广的金属材料之一。
Copper and copper alloys are one of the most widely used metals due to their excellent electric conductivity, heat conductivity, and welding ability.
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