闪光的金属剥离就是钉周围这些小孔，然后密封或房顶，为防止漏水。
Flashing is metal stripping that is nailed around the perimeters of these holes, then sealed or caulked, to prevent water leakage.
而这种药物无法弥补已产生的大脑损伤，且药物本身存在风险，因为它们也会将有用的金属元素，如铁与锌一并剥离排出体外。
But the drugs cannot reverse brain damage that has already occurred, and they carry risks of their own because they also strip useful metals from the body, such as iron and zinc.
并利用不同流化体系的橡胶与金属的粘合体的剥离行为差异很大的结果进行了验证。
The great difference of peeling behavior of rubber - to - metal bond in different vulcanized systems is also explained.
通过可调刮削器将金属切屑剥离，并关闭排放槽。
The metal swarf is stripped from the drum by adjustable scrapers and forced off the end of a discharge chute.
当你将电缆穿孔时，电缆在两个金属锯齿中下沉，这样就将电缆的塑料绝缘套剥离。
As you punch it down, the cable descends between the two metal teeth, which remove its plastic insulation (it's called insulation displacement) and the cable is cut.
这一研究对于分析H-在金属面附近的光剥离过程提供了新的理解。
This study provides a new understanding on the photodetachment process of H- in the presence of a metal surface.
结果表明金属面对光剥离过程具有重要的影响。
The results show that the metal surface has great influence on the photodetachment process.
应用BP算法程序对双金属材料的剥离强度按单隐蔽层不同结点数进行预报计算。
The captioned strength is forecasted in terms of different bonding points in a single concealed layer by means of BP calculating program.
制备金属光子晶体方法包括：电子束刻蚀结合后续剥离法、激光干涉光刻结合干刻蚀技术等。
The fabrication methods of MPC include electron beam lithography with subsequent evaporation and lift-off, interference lithography with dry-etching technology etc.
通过抑 制上述金属成分从电极（3）向发热电阻器（2）的扩散，能够防止发热电阻器（2）及电极（3）的剥离。
Removal of the heat resistive element (2) and the electrode (3) is prevented by suppressing the diffusion of the metal component from the electrode (3) to the heat resistive element (2).
金属材料高温喷漆、喷砂涂装遮蔽表面保护，高温喷漆烘烤后，易剥离不留残胶。
Metal material at high temperature paint, sandblasting masking surface protection coating, high temperature paint baking, the easy peeling without leaving adhesive residue.
但是这种光刻胶会被剥离，仅留下金属结合。
But this photoresist was then peeled off, leaving only a pure metal on metal bond.
研究了不同的表面处理方法对基板金属化剥离强度的影响规律。
The effect of different surface treatment on peel strength of substrate has been investigated.
研究了不同的表面处理方法对基板金属化剥离强度的影响规律。
The effect of different surface treatment on peel strength of substrate has been investigated.
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