该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该研究采用超小型或小型封装的可编程器件CPLD，焊接到特制的DIP封装的托座上，形成待编程的集成电路。
The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation. , and formed the integrated circuit that pending programmed.
该研究采用超小型或小型封装的可编程器件CPLD，焊接到特制的DIP封装的托座上，形成待编程的集成电路。
The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation. , and formed the integrated circuit that pending programmed.
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