双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions.
结果表明，这种抛光工艺能获得原子级的超光滑表面。
Results show that this process can reach surface roughness with angstrom dimension.
针对激光陀螺反射镜常用材料微晶玻璃的加工技术，介绍了一种较为成熟的超光滑表面加工方法—定偏心浸液式抛光。
Nano-particle colloid jet polishing is a new kind of ultra-precision machining technology which has important research and application value in fabricating ultra smooth surface.
由精密陶瓷加工，超精抛光达ra0.2，由于硬度较高，表面光滑，漆包线在其表面滑动时顺畅不受损伤。
It is made of precise ceramic and polished up to Ra0.2. high hardness and smooth surface enable the enameled wire free from hurt during surfaces sliding.
同时获得高去除率和超光滑平整的表面是硬盘磁头自由磨粒抛光的矛盾，研究自由磨粒抛光材料去除规律可以优化抛光工艺。
It is a contradiction to achieve a high material removal rate and a super smooth surface in lapping of magnetic head.
针对超精密光滑光学元件加工过程中容易出现的粗糙度较大和表面疵病较多的现象，对传统抛光机理和抛光过程中抛光粉的主要参量对抛光质量的影响进行了研究。
In view of the phenomena that the easy appearance of serious roughness and surface defects, the polishing mechanism and the influence of the main parameters on the polishing quality are researched.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
The wafer motion and the load in double-sided polishing process are main factors which affect the wafer surface quality.
使用机械 -化学抛光法加工大尺寸单晶硅可获超光滑表面 ，但很难保证良好的面型。
In Chemical-Mechanical polishing experiments we produced optical quality super smooth surfaces on single-crystal silicon, but cannot insure the surface figure.
此产品由精密陶瓷加工，超精抛光达ra0.2，由于硬度较高，表面光滑，漆包线在其表面滑动时顺畅不受损伤。
It is made of precise ceramic and polished up to Ra0.2high hardness and smooth surface enable the enameled wire free from hurt during surface sliding.
此产品由精密陶瓷加工，超精抛光达ra0.2，由于硬度较高，表面光滑，漆包线在其表面滑动时顺畅不受损伤。
It is made of precise ceramic and polished up to Ra0.2high hardness and smooth surface enable the enameled wire free from hurt during surface sliding.
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