本发明公开了一种金属基复合介质覆铜箔板。
The invention discloses a metal-based composite medium copper-clad foil plate.
介绍了覆铜箔板纸的用途，覆铜箔板的制造过程和应用。
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
它包括覆铜箔板非导磁基材、覆铜箔线圈和非导磁材料板。
It includes non - magnetizer basis material covered by copper film, winding covered by copper film and non-magnetizer material board.
本发明可降低覆铜箔基板的信号损失，提高 信号传播速度以及降低生产成本。
The invention can reduce signal loss of copper foil cladding substrate, improve signal transmission speed and reduce production cost.
其纵向截面自下而上依次是非导磁材料板、覆铜箔线圈、覆铜箔板非导磁基材。
Its lengthways section from from the top down are non-magnetizer material board, winding covered by copper film and non - magnetizer basis material covered by copper film.
覆铜箔层压板原纸的研究与生产，对造纸业改变产品结构，提高经济效益有着较大的现实意义。
The research and production of copper foil board base paper not only changes the construction of the production in papermaking industry, but also increases the economical benefit.
本文介绍了覆铜箔层压板在其生产过程、检测过程与其在PCB生产过程中的各种影响因素及结果。
The article introduce that the kinds of factor and result of CCL in its Producing Process, Testing Process and PCB Producing Process.
覆铜箔线圈每匝之间的间隔距离是等距离的，或每匝之间的间隔距离为内宽外窄，循序渐进形成内疏外密状；
The distance of each two wind is equal, or inner wide outer narrow to form the style of inner sparse outer dense bit by bit.
覆铜箔层压板原纸是生产印刷线路板用全纸基覆铜箔层压板的基础材料，是一种生产难度较高的特种工业用纸。
The copper foil board base paper is the fundamental material to product the paper of printing line board, and also is a kind of higher degree special industrial paper.
通过对影响覆铜箔层压板原纸主要因素的分析，结合生产实际提出了控制措施，对该产品的生产有一定的借鉴意义。
This paper analyzed the main influential factors of the copper foil board base paper, and put forward control measures combining with the practice production, which…
铜和塑料复合物及铜和塑料混合物分离：如电子线路板覆铜铜箔的回收，废旧铜线铜和塑料的回收。
Copper and plastic compounds and mixtures of copper and plastic separation: such as electronic circuit board copper foil recycling, waste plastic recycling copper and copper wire.
本文介绍了一种新的覆铜板铜箔胶粘剂，应用于酚醛纸板上，具有较高的耐漏电起痕性；
This paper introduces a new copper foil adhesive for bakelite paper laminate. The adhesive raises the comparative tracking index (CTI), proof welding, peel strength of the laminate.
铜箔胶带也叫自粘铜箔，是在铜金属表面覆一层亚克力胶，可分为：双导铜箔胶带和单导铜箔胶带。
Also called adhesive copper foil and copper foil tape is the copper metal surface covered a layer of acrylic rubber, can be divided into: double guide copper foil tape and single copper foil tape.
铜箔胶带也叫自粘铜箔，是在铜金属表面覆一层亚克力胶，可分为：双导铜箔胶带和单导铜箔胶带。
Also called adhesive copper foil and copper foil tape is the copper metal surface covered a layer of acrylic rubber, can be divided into: double guide copper foil tape and single copper foil tape.
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