覆铜箔层压板原纸的研究与生产，对造纸业改变产品结构，提高经济效益有着较大的现实意义。
The research and production of copper foil board base paper not only changes the construction of the production in papermaking industry, but also increases the economical benefit.
本文介绍了覆铜箔层压板在其生产过程、检测过程与其在PCB生产过程中的各种影响因素及结果。
The article introduce that the kinds of factor and result of CCL in its Producing Process, Testing Process and PCB Producing Process.
覆铜箔层压板原纸是生产印刷线路板用全纸基覆铜箔层压板的基础材料，是一种生产难度较高的特种工业用纸。
The copper foil board base paper is the fundamental material to product the paper of printing line board, and also is a kind of higher degree special industrial paper.
通过对影响覆铜箔层压板原纸主要因素的分析，结合生产实际提出了控制措施，对该产品的生产有一定的借鉴意义。
This paper analyzed the main influential factors of the copper foil board base paper, and put forward control measures combining with the practice production, which…
通过对影响覆铜箔层压板原纸主要因素的分析，结合生产实际提出了控制措施，对该产品的生产有一定的借鉴意义。
This paper analyzed the main influential factors of the copper foil board base paper, and put forward control measures combining with the practice production, which…
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