装配过程优化。
提出了一种多工位薄板装配过程测点优化设计方法。
An optimal sensor design method was presented for the multistation sheet metal assembly processes.
根据优化设计的结果，进行了静态应力分析和动态应力分析，确保了后续装配过程的安全性。
According to the results of optimizing design, we carried out the static stress analysis and the dynamic stress analysis, and insured the safety of the later assemble processes.
提出了MEWMA控制图参数优化方法，对电子产品装配中的表面贴片工艺过程的焊点质量控制进行了研究。
Based on the procedure for parametrical optimization of MEWMA control chart, a case study of its application in surface mount process for the solder joint quality control was presented.
提出了MEWMA控制图参数优化方法，对电子产品装配中的表面贴片工艺过程的焊点质量控制进行了研究。
Based on the procedure for parametrical optimization of MEWMA control chart, a case study of its application in surface mount process for the solder joint quality control was presented.
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