本发明涉及一种半导体装配用胶粘剂膜组合物、胶粘剂膜以 及划片晶粒粘结膜。
The invention relates to an adhesive film composition for assembly of semiconductor, an adhesive film and scribing crystal particle binding film.
本发明涉及一种半导体装配用胶粘剂膜组合物、胶粘剂膜以 及划片晶粒粘结膜。
The invention relates to an adhesive film composition for assembly of semiconductor, an adhesive film and scribing crystal particle binding film.
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