塑封集成电路因其是非气密性封装，封装材料热膨胀系数的不同以及被粘接材料表面能低，是造成塑封电路离层或开裂的内部原因。

First of all, the internal reason for the delamination or cracking is the different CTE of the packaging materials and the low surface energy of the adhesions.

youdao

体育场，对不起，传感器的表面积跟普通的大规模集成电路比起来是难以置信的大。

And the surface area of this stadium, sorry, sensor is unbelievably huge when compared with the average LSI.

youdao

体育场，对不起，传感器的表面积跟普通的大规模集成电路比起来是难以置信的大。

And the surface area of this stadium, sorry, sensor is unbelievably huge when compared with the average LSI.

youdao